Company
<Specification>
●Standard nozzle：HS-812
●Maximum ejection amount：18L/分（60Hz）
●Vacuum attainment level：80kPa
●External dimensions（iron）：120（W）×160（H）×35（D）mm
●Weight：Station partition・5.7kg/iron partition・160g
<Features>
●Speedy temperature rise to 300 ℃ in 45 seconds.Heating structure with excellent heat conduction achieves 300 ℃ in 45 seconds.When you want to use, you can use immediately.
●One-touch exchange can be performed easily at hand：Filter cartridge can be one-touch exchanged such as installing or removing at hand even working.
●Lead-free solder board corresponds
●"Nozzle clogging mitigating procedures mechanism" loading machine
●Clogging significant decrease：It is strong and hard to clogging by large diameter suction pipe with inner diameter of 3.8mmφ and standard equipment of special alloy nozzle strong to corrosion.
● Whole chip parts suctionBy using the :nozzle for chip parts sold separately ,it can circle the chip parts.
●Replacement parts：nozzle（HS-811～HS-818）・nozzle set（HS-812Cu/813Cu）・paper filter（HS-825）・filter cartridge（HS-821）・filter cartridge set（HS-820）・filter O ring set（HS-826）・nipple O ring（HS-827）・pump filter（HS-822）・heater unit（HS-810）
●Option：Maintenance Kit（HS-830）・Pipe cleaning rod（HS-801-36）・nozzle cleaning rod（HS-801-39）・2-pin conversion adapter（HS-
<Use for>
<Note>
●If you are using lead-free solder, we recommend that you be on time for replacement of the filter cartridge and maintenance of bit.
