Single- and double-sided PCBs
Your direct benefit: Manufacture according to standard parameters
- Time and cost savings through reduced design and work preparation workload
- Yield optimisation on both sides
- Clear and unambiguous communication
- Stable transition from prototype to series production
| Properties | Values |
|---|---|
| max. circuit board size | 570 x 500 mm |
| circuit board thickness | max. 2.4 mm* min. 0.6 mm |
| copper cladding (base copper) | 18 µm, 35 µm, 70 µm, 105 µm |
| material | FR4 (TG 135, TG 150, TG 170) |
| surface finishes | HAL, HAL lead-free, electroless nickel/ immersion gold, immersion tin, immersion silver |
| min. tool diameter | 0.25 mm |
| min. conductor track width and distance | 100/100 µm |
| aspect ratio (hole diameter : circuit board thickness) | 1 : 8 |
| additional printing |
|
| * greater thickness upon request |
| Documentation | Standard |
|---|---|
| Inspection certificate | According to DIN EN 10204 |
| Factory inspection certificate |
|
| Initial sample inspection “standard” |
|
| Initial sample inspection “thorough” |
|
| Lead-free | Layer thickness | Shelf life | Comments | |
|---|---|---|---|---|
| Hot Air Leveling (HAL) | No (HAL SnPb) | 1... 40 μm | 12 months |
|
| Hot Air Leveling (HAL) | Yes | 1... 40 μm | 12 months |
|
| Chemical nickel-gold cNiAu | Yes | 4 ... 7 μm Ni 0,075…±0,025 μm Au |
12 months |
|
| Chemical tin cSn | Yes | 0,8 ... 1,1 μm | 6 months |
|
| Chemical silver cAg | Yes | 0,25 ... 0,35 μm | 12 months |
|
